loading
| Availability: | |
|---|---|
| Quantity: | |
Product Description
 | Advantages of 96% Alumina Aln Ceramic Substrate:Ceramic Substrate is a frequently used electronic packaging material, widely used in the packaging of the hybrid integrated circuit and multichip module. |
Features of Aln Ceramic Substrate: 1. High density assembly 2. Free of organic components, cosmic ray resistant, high reliability in aerospace, long service life3. Copper layer does not contain oxide layer, can be used in reductive atmosphere for a long time |  |
 | Application of 96% Alumina Ceramic Substrate: |
Technology of coating Metallized Ceramic Substrate: Our company is specialized in high-power ceramic heat dissipation substrates such as aluminum nitride and aluminum oxide,with thermal conductivity of 20-240w /M.K. Coating types: gold, platinum, silver etc. |  |
Company Profile
Packaging & Shipping
Packing Details | We will packing by professional export packing,safety against breakage, finally into the wooden cases/ carton/pallet or customized package. We have ERP authentication. |
Delivery Details | We can deliver by SEA,air,rail transportation,the China-Europe Railway Express etc. TNT, DHL,UPS, FEDEX, EMS，S.F EXPRESS etc. |
| 1. Sample service | 2. Optimal price | 3. Customized logo |
| 4. Fast feedback | 5. Customized size | 6. Safety package |
| 7. ISO9001 | 8. Aftersale service | 9. Low procurement risk |
Product Description
| Advantages of 96% Alumina Aln Ceramic Substrate:Ceramic Substrate is a frequently used electronic packaging material, widely used in the packaging of the hybrid integrated circuit and multichip module. |
Features of Aln Ceramic Substrate: 1. High density assembly 2. Free of organic components, cosmic ray resistant, high reliability in aerospace, long service life3. Copper layer does not contain oxide layer, can be used in reductive atmosphere for a long time | |
| Application of 96% Alumina Ceramic Substrate: |
Technology of coating Metallized Ceramic Substrate: Our company is specialized in high-power ceramic heat dissipation substrates such as aluminum nitride and aluminum oxide,with thermal conductivity of 20-240w /M.K. Coating types: gold, platinum, silver etc. | |
Company Profile
Packaging & Shipping
Packing Details | We will packing by professional export packing,safety against breakage, finally into the wooden cases/ carton/pallet or customized package. We have ERP authentication. |
Delivery Details | We can deliver by SEA,air,rail transportation,the China-Europe Railway Express etc. TNT, DHL,UPS, FEDEX, EMS，S.F EXPRESS etc. |
| 1. Sample service | 2. Optimal price | 3. Customized logo |
| 4. Fast feedback | 5. Customized size | 6. Safety package |
| 7. ISO9001 | 8. Aftersale service | 9. Low procurement risk |
